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晶圆测试是半导体器件制造过程的一个步骤，在后道工序完成后，就要进行晶圆测试。人们要对晶圆上的所有的集成电路进行检测（ATPG），以确认是否存在功能缺陷。检测设备叫作晶圆探针台。晶圆探针台有探针，探针会竖起来扎到焊盘进行测试。

参考文献