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物理气相沉积

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物理气相沉积(英语:Physical vapor depositionPVD)是一种工业制造上的工艺,属于镀膜技术的一种,是主要利用物理方式来加热或激发出材料过程来沉积薄膜的技术,即真空镀膜(蒸镀),多用在切削工具与各种模具的表面处理,以及半导体装置的制作工艺上。

化学气相沉积相比,物理气相沉积适用范围广泛,几乎所有材料的薄膜都可以用物理气相沉积来制备,但是薄膜厚度的均匀性是物理气相沉积中的一个问题。

主要的物理气相沉积的方法有[1]

物理气相沉积
蒸镀(Evaporative PVD)

电阻蒸发 Resistive PVD

感应蒸发 Inductive PVD

激光蒸发 Laser PVD

电子束蒸发 EB PVD

灯丝电子束

溅镀 Sputtering PVD

双极溅射

磁控溅射

平衡式磁控溅射(Balanced Magnetron Sputtering)

不平衡式磁控溅射(Unbalanced Magnetron Sputtering,简称:UBS)

离子束溅射

三极溅射

离子镀 Ion Plating PAPVD

直流二极等离子辅助物理气相沉积

三极活性反应蒸发

射频离子镀

脉冲等离子体离子镀

离子束辅助

中空阴极放电(HCD:Hollow Cathode Discharge)

电弧放电式(Arc)

电弧结合不平衡磁场溅射混合式(ABS:Arc Bond Sputter)

参见

参考文献

  1. ^ 金海波 (编). 现代表面处理新工艺、新技术与新标准 (PDF). 当代中国音像出版社. : 27 [2020-07-23]. (原始内容存档 (PDF)于2021-04-14). 

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物理气相沉积
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