![cover image](https://wikiwandv2-19431.kxcdn.com/_next/image?url=https://upload.wikimedia.org/wikipedia/commons/thumb/8/81/LM2576T_Damaged_die.jpg/640px-LM2576T_Damaged_die.jpg&w=640&q=50)
Die (integrated circuit)
Unpackaged integrated circuit / From Wikipedia, the free encyclopedia
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A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut (diced) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die.
![Thumb image](http://upload.wikimedia.org/wikipedia/commons/thumb/4/41/1_watt_red_power_led.jpg/320px-1_watt_red_power_led.jpg)
![Die of LM2576T monolithic integrated circuits step−down switching regulator (buck converter) which contains 162 active transistors (based on datasheet). The Biggest part of die on the left side is Built-in 3 Ampere power transistor and the damaged and fried part of die is clearly visible as a small black in power transistor section.](http://upload.wikimedia.org/wikipedia/commons/thumb/8/81/LM2576T_Damaged_die.jpg/640px-LM2576T_Damaged_die.jpg)
There are three commonly used plural forms: dice, dies, and die.[1][2] To simplify handling and integration onto a printed circuit board, most dies are packaged in various forms.