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Dicing saw
Precision saw used to cut semiconductor wafers and other electronic materials From Wikipedia, the free encyclopedia
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A dicing saw is a kind of saw which employs a high-speed spindle fitted with an extremely thin diamond blade or diamond wire[1] to dice, cut, or groove semiconductor wafers, and glass, ceramic, crystal, and many other types of material.
 | This article needs additional citations for verification. (December 2009) |
The thickness of the cutting blades used varies with the material being cut, and is of about 20 μm to 35 μm when cutting silicon wafers[citation needed]. Japanese companies, such as DISCO Corporation and Accretech (Tokyo Seimitsu), account for about 90% of dicing saw sales[citation needed]. In the past, cutting 1/2 to 2/3 of wafer thickness was the mainstream; with large diameter wafers on dicing tape, full cut cutting is becoming mainstream[citation needed].
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See also
- Diamond tools
- Disco Corporation – a manufacturer of dicing saws
References
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