LGA 1200

LGA 1200, also known as Socket H5, is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Comet Lake (10th gen) and Rocket Lake (11th-gen) desktop CPUs, which was released in April 2020.^[1][2]

LGA 1200

Release date	May 27, 2020 (2020-05-27)
Designed by	Intel
Manufactured by	Foxconn
Type	LGA-ZIF
Chip form factors	Flip-chip
Contacts	1200
FSB protocol	PCI Express
Processors	Comet Lake Rocket Lake
Predecessor	LGA 1151
Successor	LGA 1700
Memory support	DDR4
This article is part of the CPU socket series

LGA 1200 is designed as a replacement for the LGA 1151 (known as Socket H4). LGA 1200 is a land grid array mount with 1200 protruding pins to make contact with the pads on the processor. It uses a modified design of LGA 1151, with 49 more pins on it, improving power delivery and offering support for future incremental I/O features. Pin 1 position remains the same as it was in previous generation processors, but it has shifted socket keying to left (previously it was right), making Comet Lake processors incompatible both electrically and mechanically with previous chips.^[3]

ASRock, Asus, Biostar, Gigabyte and MSI have confirmed their motherboards based on the Intel Z490 chipset support the 11th generation Intel Rocket Lake desktop CPUs.^[4][5][6][7] Full PCIe 4.0 support is confirmed for selected brands. ASUS did not include support to PCIe 4.0 on M.2, hindering support for PCIe gen 4.0 NVMe SSDs.^[8][9]

Heatsink

Pads of an Intel Core i9-10900K

The 4 holes for fastening the heatsink to the motherboard are placed in a square with a lateral length of 75 mm for Intel's sockets LGA 1156, LGA 1155, LGA 1150, LGA 1151 and LGA 1200. Cooling solutions should therefore be interchangeable.^[10][11][12]

Comet Lake chipsets (400 series)

Memory support configuration common for all chipsets:

• Dual channel DDR4-2666 or DDR4-2933

		H410	B460	H470	Q470	Z490	W480
Overclocking		Thermal limits CPU overclocking is offered by ASRock, ASUS and MSI[13][14]			No	Yes	No
Bus Interface		DMI 3.0 x4
CPU support		Comet Lake-S only[15][16]		Comet Lake-S / Rocket Lake (a BIOS update is required)[16][17]
Memory support		Up to 64 GB	Up to 128 GB
Maximum DIMM slots		2	4
Maximum USB 2.0 ports		10	12	14
USB 3.2 ports configuration	Gen 1x1	Up to 4	Up to 8		Up to 10
	Gen 2x1	N/A		Up to 4	Up to 6		Up to 8
Maximum SATA 3.0 ports		4	6				8
Processor PCI Express v3.0 configuration		1x16			1x16 or 2x8 or 1x8+2x4
PCH PCI Express configuration		6	16	20	24
Independent Display Support (digital ports/pipes)		2	3
Integrated Wireless (802.11ax)		No		Intel Wi-Fi 6 AX201[a]
SATA RAID 0/1/5/10 support		No	Yes
Intel Optane Memory Support
Intel Smart Sound Technology
Intel Active Management, Trusted Execution and vPro Technology		No			Yes	No	Yes
Chipset TDP		6W
Chipset lithography		22 nm[18]		14 nm[18]
Release date		Q2 2020

Rocket Lake chipsets (500 series)

Memory support configuration common for all chipsets (except W580):

• Dual channel
• DDR4-3200 for 11th generation Rocket Lake Core i9/i7/i5 CPUs
• DDR4-2933 for 10th generation Comet Lake Core i9/i7 CPUs
• DDR4-2666 for all other CPUs
• Up to 128 GB using 32 GB modules; maximum 64 GB for the H510 chipset

W580 based motherboards support DDR4-3200 RAM in dual channel mode.

			H510	B560	H570	Q570	Z590	W580
Overclocking			No	RAM only		No	Yes	RAM only
Bus Interface			DMI 3.0 x4		DMI 3.0 x8 (runs in x4 mode for Comet Lake-S CPUs)
CPU support			Comet Lake-S / Rocket Lake					Rocket Lake
Maximum DIMM slots			2	4
Maximum USB 2.0 ports			10	12	14
USB 3.2 ports configuration	Gen 1x1		Up to 4	Up to 6	Up to 8	Up to 10	Up to 10
	Gen 2	x1	—	Up to 4		Up to 8
		x2		Up to 2		Up to 3
Maximum SATA 3.0 ports			4	6				8
Processor PCI Express v4.0 configuration			1x16	1x16 + 1x4		1x16 + 1x4 or 2x8 + 1x4 or 1x8 + 3x4
PCH PCI Express configuration			6	12	20	24
Independent Display Support (digital ports/pipes)			2	3
Integrated Wireless (802.11ax)			Intel Wi-Fi 6 AX201[a]
PCIe RAID 0/1/5/10 support			No		Yes
SATA RAID 0/1/5/10 support			No		Yes
Intel Optane Memory Support			No	Yes
Intel Smart Sound Technology
Intel Active Management, Trusted Execution and vPro Technology			No			Yes	No	Yes
Chipset TDP			6W
Chipset lithography			14 nm[citation needed]
Release date			Q1 2021			Q2 2021	Q1 2021	Q2 2021

1. depends on OEM's implementation

See also

• List of Intel microprocessors
• List of Intel chipsets