Zen+

Zen+ is the name for a computer processor microarchitecture by AMD. It is the successor to the first gen Zen microarchitecture,^[3] and was first released in April 2018,^[4] powering the second generation of Ryzen processors, known as Ryzen 2000 for mainstream desktop systems, Threadripper 2000 for high-end desktop setups and Ryzen 3000G (instead of 2000G) for accelerated processing units (APUs).

AMD Zen+

General information
Launched	April 2018
Designed by	AMD
Common manufacturer	GlobalFoundries
CPUID code	Family 17h
Cache
L1 cache	64 KB instruction, 32 KB data per core
L2 cache	512 KB per core
L3 cache	8 MB per CCX (APU: 4 MB)
Architecture and classification
Technology node	12 nm (FinFET)
Microarchitecture	Zen
Instruction set	AMD64 (x86-64)
Physical specifications
Transistors	4.8 billion per 8-core "Zeppelin" die
Cores	4–6 (mainstream) 8 (performance) 12–32 (enthusiast)[1]
Sockets	Socket AM4 Socket TR4
Products, models, variants
Product code names	Pinnacle Ridge (Desktop)[2] Colfax (HEDT)[1] Picasso (APU/Embedded)
Brand names	Ryzen Ryzen Threadripper Athlon
History
Predecessor	Zen (1st gen)
Successor	Zen 2
Support status
Supported

Features

Die shot of Ryzen 5-2600

An AMD Ryzen 5 2600

Zen+ uses GlobalFoundries' 12 nm fabrication process,^[5] an optimization of the 14 nm process used for Zen, with only minor design rule changes.^[6] This means that the die sizes between Zen and Zen+ are identical as AMD chose to use the new smaller transistors to increase the amount of empty space, or "dark silicon", between the various features on the die. This was done to improve power efficiency & reduce thermal density to allow for higher clock speeds, rather than design an entirely new floorplan for a physically smaller die (which would have been significantly more work and thus more expensive).^[7] These process optimizations allowed 12 nm Zen+ to clock about +250 MHz (≈6%) higher, or to lower power consumption when at the same frequency by 10%, when compared to their prior 14 nm Zen products.^[8] Although conversely at the microarchitecture level, Zen+ had only minor revisions versus Zen.^[6] Known changes to the microarchitecture include improved clock speed regulation in response to workload ("Precision Boost 2"),^[9] reduced cache and memory latencies (some significantly so), increased cache bandwidth, and finally improved IMC performance allowing for better DDR4 memory support (officially JEDEC rated to support up to 2933 MHz compared to just 2666 MHz on the prior Zen core),^[10] and fixed many hardware bugs found on Zen 1, such as fTPM / PSP bugs on Zen 1, and SVM / SLAT bugs on Zen 1.

Zen+ also supports improvements in the per-core clocking features, based on core utilization and CPU temperatures.^[6] These changes to the core utilization, temperature, and power algorithms are branded as "Precision Boost 2" and "XFR2" ("eXtended Frequency Range 2"), evolutions of the first-generation technologies in Zen. On Zen, XFR gave an additional 50 to 200 MHz clock speed increase (in 25 MHz increments) over the maximum Precision Boost clocks. For Zen+, XFR2 is no longer listed as a separate clock modifier. Instead, the XFR temperature, power, and clock monitoring and logic feeds into the Precision Boost 2 algorithm to adjust clocks and power consumption opportunistically and dynamically.^[11][12]

Ultimately, the changes in Zen+ resulted in a 3% improvement in IPC over Zen; which in conjunction with 6% higher clock speeds resulted in up to 10% overall increase in performance.^[6]

Feature tables

CPUs

APUs

APU features table

Products

Desktop CPUs

Common features of Ryzen 2000 desktop CPUs:

• Socket: AM4.
• All the CPUs support DDR4-2933 in dual-channel mode, except for R7 2700E, R5 2600E, R5 1600AF and R3 1200AF which support it at DDR4-2666 speeds.
• All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
• No integrated graphics.
• L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
• L2 cache: 512 KB per core.
• Fabrication process: GlobalFoundries 12LP (14LP+).

Branding and Model		Cores (threads)	Clock rate (GHz)		L3 cache (total)	TDP	Core config[i]	Release date	Launch price[a]
			Base	PB2
Ryzen 7	2700X[13][b]	8 (16)	3.7	4.3	16 MB	105 W	2 × 4	April 19, 2018	US $329
	2700[13][b]		3.2	4.1		65 W			US $299
	2700E		2.8	4.0		45 W		September 19, 2018	OEM
Ryzen 5	2600X[13]	6 (12)	3.6	4.2		95 W	2 × 3	April 19, 2018	US $229
	2600[13][b]		3.4	3.9		65 W			US $199
	2600E		3.1	4.0		45 W		September 19, 2018	OEM
	1600 (AF)[17][c]		3.2	3.6		65 W		October 11, 2019[18]	US $85
	2500X	4 (8)	3.6	4.0	8 MB		1 × 4	September 10, 2018	OEM
Ryzen 3	2300X	4 (4)	3.5
	1200 (AF)[19][c]		3.1	3.4				April 21, 2020	US $60

• v
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• e

1. Core Complexes (CCX) × cores per CCX

1. Manufacturer suggested retail price at launch
2. Model also available as PRO version as 2600^[14], 2700^[15], 2700X^[16], released on September 19, 2018.
3. AF models are 12 nm Zen+ refresh of 14 nm Zen models (1200^[20] and 1600^[21] with "AF" instead of "AE" in the part numbers).

Common features of Ryzen 2000 HEDT CPUs:

• Socket: TR4.
• All the CPUs support DDR4-2933 in quad-channel mode.
• All the CPUs support 64 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
• No integrated graphics.
• L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
• L2 cache: 512 KB per core.
• Fabrication process: GlobalFoundries 12LP (14LP+).

Branding and Model		Cores (threads)	Clock rate (GHz)		L3 cache (total)	TDP	Chiplets	Core config[i]	Release date	Launch price[a]
			Base	PB2
Ryzen Threadripper	2990WX[22]	32 (64)	3.0	4.2	64 MB	250 W	4 × CCD	8 × 4	Aug 13, 2018	US $1799
	2970WX[22]	24 (48)						8 × 3	Oct 2018	US $1299
	2950X[22]	16 (32)	3.5	4.4	32 MB	180 W	2 × CCD	4 × 4	Aug 31, 2018	US $899
	2920X[22]	12 (24)		4.3				4 × 3	Oct 2018	US $649

• v
• t
• e

1. Manufacturer suggested retail price at launch

1. Core Complexes (CCX) × cores per CCX

Desktop APUs

Common features of Zen+ based desktop APUs:

• Socket: AM4.
• All the CPUs support DDR4-2933 in dual-channel mode, while Athlon Pro 300GE and Athlon Silver Pro 3125GE support only DDR4-2666.
• L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 16 PCIe 3.0 lanes.
• Includes integrated GCN 5th generation GPU.
• Fabrication process: GlobalFoundries 12LP.

Model	CPU				GPU				TDP	Release date	Release price
	Cores (threads)	Clock rate (GHz)		L3 cache (total)	Model[i]	Config[ii]	Clock (MHz)	Processing power (GFLOPS)[iii]
		Base	Boost
Athlon Pro 300GE	2 (4)	3.4	—	4 MB	Vega 3	192:12:4 3 CU	1100	424.4	35 W	Sep 30, 2019	OEM
Athlon Silver Pro 3125GE					Radeon Graphics					Jul 21, 2020
Athlon Gold 3150GE	4 (4)	3.3	3.8
Athlon Gold Pro 3150GE
Athlon Gold 3150G		3.5	3.9						65 W
Athlon Gold Pro 3150G
Ryzen 3 3200GE		3.3	3.8		Vega 8	512:32:16 8 CU	1200	1228.8	35 W	Jul 7, 2019
Ryzen 3 Pro 3200GE										Sep 30, 2019
Ryzen 3 3200G		3.6	4.0				1250	1280	65 W	Jul 7, 2019	US $99[26]
Ryzen 3 Pro 3200G										Sep 30, 2019	OEM
Ryzen 5 Pro 3350GE		3.3	3.9		Radeon Graphics	640:40:16 10 CU	1200	1536	35 W	Jul 21, 2020
Ryzen 5 Pro 3350G	4 (8)	3.6	4.0				1300	1830.4	65 W
Ryzen 5 3400GE		3.3			Vega 11	704:44:16 11 CU			35 W	Jul 7, 2019
Ryzen 5 Pro 3400GE										Sep 30, 2019
Ryzen 5 3400G		3.7	4.2		RX Vega 11		1400	1971.2	65 W	Jul 7, 2019	US $149[26]
Ryzen 5 Pro 3400G					Vega 11					Sep 30, 2019	OEM

• v
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• e

1. Starting with 2020 releases, AMD stopped referring to integrated graphics as "Vega", therefore all Vega based iGPUs are branded as AMD Radeon Graphics (instead Radeon Vega 3 or Radeon Vega 10).^[23][24][25]
2. Unified shaders : Texture mapping units : Render output units and Compute units (CU)
3. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Mobile APUs

Common features of Ryzen 3000 notebook APUs:

• Socket: FP5.
• All the CPUs support DDR4-2400 in dual-channel mode.
• L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 16 PCIe 3.0 lanes.
• Includes integrated GCN 5th generation GPU.
• Fabrication process: GlobalFoundries 12LP (14LP+).

Branding and Model		CPU					GPU				TDP	Release date
		Cores (threads)	Clock rate (GHz)		L3 cache (total)	Core config[i]	Model	Clock (GHz)	Config[ii]	Processing power (GFLOPS)[iii]
			Base	Boost
Ryzen 7	3780U[27]	4 (8)	2.3	4.0	4 MB	1 × 4	RX Vega 11	1.4	704:44:16 11 CU	1971.2	15 W	Oct 2019
	3750H[28]						RX Vega 10		640:40:16 10 CU[29]	1792.0	35 W	Jan 6, 2019
	3700C[30]										15 W	Sep 22, 2020
	3700U[a][31]											Jan 6, 2019
Ryzen 5	3580U[32]		2.1	3.7			Vega 9	1.3	576:36:16 9 CU	1497.6		Oct 2019
	3550H[33]						Vega 8	1.2	512:32:16 8 CU[34]	1228.8	35 W	Jan 6, 2019
	3500C[35]										15 W	Sep 22, 2020
	3500U[a][36]											Jan 6, 2019
	3450U[37]			3.5								Jun 2020
Ryzen 3	3350U[38]	4 (4)					Vega 6		384:24:8 6 CU[39]	921.6		Jan 6, 2019
	3300U[a][40]

• v
• t
• e

1. Core Complexes (CCX) × cores per CCX
2. Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
3. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

1. Model also available as PRO version^[41][42][43], released April 8, 2019.

Embedded APUs

In 2022, AMD announced the R2000 series of embedded APUs.^[44]

Model	Release date	Fab	CPU						GPU				Socket	PCIe support	Memory support	TDP
			Cores (threads)	Clock rate (GHz)		Cache			Archi- tecture	Config[i]	Clock (GHz)	Processing power[ii] (GFLOPS)
				Base	Boost	L1	L2	L3
R2312[45]	June 7, 2022[46]	GloFo 12LP	2 (4)	2.7	3.5	64 KB inst. 32 KB data per core	512 KB per core	4 MB	GCN 5	192:12:4 3 CU	1.2	460.8	FP5	8 lanes Gen 3	DDR4-2400 dual-channel ECC	10–25 W
R2314[45]			4 (4)	2.1						384:24:8 6 CU		921.6		16 lanes Gen 3	DDR4-2666 dual-channel ECC	10–35 W

• v
• t
• e

1. Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
2. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

See also

• AMD K9
• AMD K10
• Jim Keller (engineer)
• Ryzen
• Steamroller (microarchitecture)
• Zen (microarchitecture)
• Zen 2