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List of AMD mobile processors

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Features overview

CPUs

APUs

APU features table

Initial platform (2003)

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Launched in 2003, the initial platform for mobile AMD processors consists of:

More information AMD mobile, Initial platform ...

Mobile Sempron

"Dublin" (Socket 754, CG, 130 nm, Desktop replacement)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit

More information Model Number, Frequency ...

"Dublin" (Socket 754, CG, 130 nm, Low power)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit

More information Model Number, Frequency ...

"Georgetown" (Socket 754, D0, 90 nm, Desktop replacement)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit

More information Model Number, Frequency ...

"Sonora" (Socket 754, D0, 90 nm, Low power)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit

More information Model Number, Frequency ...

"Albany" (Socket 754, E6, 90 nm, Desktop replacement)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit

More information Model Number, Frequency ...

"Roma" (Socket 754, E6, 90 nm, Low power)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit

More information Model Number, Frequency ...

Mobile Athlon 64

"ClawHammer" (C0 & CG, 130 nm, Desktop replacement)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

More information Model Number, Frequency ...

"ClawHammer" (C0 & CG, 130 nm, 62 W TDP)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

More information Model Number, Frequency ...

"ClawHammer" (CG, 130 nm, 35 W TDP)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

More information Model Number, Frequency ...

"Odessa" (CG, 130 nm, Desktop replacement)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

More information Model Number, Frequency ...

"Odessa" (CG, 130 nm, 35 W TDP)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

More information Model Number, Frequency ...

"Oakville" (D0, 90 nm, 35 W TDP Low Power)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

More information Model Number, Frequency ...

"Newark" (E5, 90 nm, 62 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

More information Model Number, Frequency ...

Turion 64

"Lancaster" (90 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

More information Model Number, Frequency ...
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Kite platform (2006)

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Introduced in 2006, the Kite platform consists of:

More information AMD mobile, Kite platform ...

Mobile Sempron

"Keene" (Socket S1, F2, 90 nm, Low power)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

More information Model Number, Frequency ...

Turion 64

"Richmond" (90 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

More information Model Number, Frequency ...

Turion 64 X2

"Taylor" (90 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

More information Model Number, Frequency ...

"Trinidad" (90 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

More information Model Number, Frequency ...
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Kite Refresh platform (2007)

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AMD used Kite Refresh as the codenamed for the second-generation AMD mobile platform introduced in February 2007.

More information AMD mobile, Kite Refresh platform ...

Mobile Sempron

"Sherman" (Socket S1, G1 & G2, 65 nm, Low power)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64

More information Model Number, Frequency ...

Athlon 64 X2

"Tyler" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

More information Model Number, Frequency ...

Turion 64 X2

"Tyler" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

More information Model Number, Frequency ...
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Puma platform (2008)

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The Puma platform introduced in 2008 with June 2008 availability for the third-generation AMD mobile platform consists of:

More information AMD mobile, Initial platform ...

Mobile Sempron

"Sable" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

More information Model Number, Frequency ...

Athlon X2

"Lion" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

More information Model Number, Frequency ...

Turion X2

"Lion" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

More information Model Number, Frequency ...

Turion X2 Ultra

"Lion" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

More information Model Number, Frequency ...
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Yukon platform (2009)

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The Yukon platform was introduced on January 8, 2009, with expected April availability for the first AMD Ultrathin Platform targeting the ultra-portable notebook market.

More information AMD mobile, Initial platform ...

Sempron

"Huron" (65 nm, Low power)

  • Both models support: MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64
  • Sempron 210U supports extra AMD-V
More information Model Number, Frequency ...

Athlon Neo

"Huron" (65 nm, 15 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!, AMD-V[4]

More information Model Number, Frequency ...

"Sherman" (65 nm, 15 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

More information Model Number, Frequency ...

"Congo" (65 nm, 13 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

More information Model Number, Frequency ...

Turion

"Congo" (65 nm, 20 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

More information Model Number, Frequency ...
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Congo platform (2009)

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The Congo platform [5] was introduced in September 2009, as the second AMD Ultrathin Platform targeting the ultra-portable notebook market.

More information AMD mobile, Initial platform ...

Athlon Neo X2

"Conesus" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, AMD-V

More information Model Number, Frequency ...

Turion Neo X2

"Conesus" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, AMD-V, PowerNow!

More information Model Number, Frequency ...
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Tigris platform (2009)

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The Tigris platform [6] introduced in September 2009 for the AMD Mainstream Notebook Platform consists of:

More information AMD mobile, Initial platform ...

Sempron

"Caspian" (45 nm)

Single-core mobile processor

MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

More information Model Number, Frequency ...

Athlon II

"Caspian" (45 nm)

Dual-core mobile processor

MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

More information Model number, Frequency ...

Turion II

"Caspian" (45 nm)

Dual-core mobile processor

MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

More information Model number, Clockspeed ...

Turion II (Ultra)

"Caspian" (45 nm)

Dual-core mobile processor

MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

More information Model number, Clockspeed ...
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Nile platform (2010)

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The Nile platform [7][8] introduced on May 12, 2010, for the third AMD Ultrathin Platform consists of:

More information AMD mobile, Initial platform ...
  • MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
  • Memory support: DDR3 SDRAM, DDR3L SDRAM (Up to 1066)

V series

"Geneva" (45 nm)

Single-core mobile processor

More information Model number, Clockspeed ...

Athlon II Neo

"Geneva" (45 nm)

Single-core mobile processor Single-core mobile processor

More information Model number, Frequency ...

Dual-core mobile processor

More information Model number, Frequency ...

Turion II Neo

"Geneva" (45 nm)

Dual-core mobile processor

More information Model number, Clockspeed ...

Danube platform (2010)

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Perspective

The Danube platform[7][10] introduced on May 12, 2010, for the AMD Mainstream Notebook Platform consists of:

More information AMD mobile, Initial platform ...
  • MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
  • Memory support: DDR3 SDRAM, DDR3L SDRAM (Up to 1066 MHz)

V series

Champlain (45 nm)

Single-core mobile processor

More information Model number, Clockspeed ...

Athlon II

Champlain (45 nm)

Dual-core mobile processor

More information Model Number, Frequency ...

Turion II

Champlain (45 nm)

Dual-core mobile processor

More information Model number, Clockspeed ...

Phenom II

  • MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
  • Unlike desktop models, mobile Phenom II-based models do not have L3 cache
  • Memory support: DDR3 SDRAM, DDR3L SDRAM (Up to 1333 MHz)

Champlain (45 nm)

Dual-core mobile processor

More information Model number, Clockspeed ...

Triple-core mobile processors

More information Model number, Clockspeed ...

Quad-core mobile processors

More information Model number, Clockspeed ...

Brazos platform (2011)

AMD Ultrathin Platform introduced on January 5, 2011, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It features the 40 nm AMD Ontario (a 9-watt AMD APU for netbooks and small form factor desktops and devices) and Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and all-in-ones) APUs. Both low-power APU versions feature two Bobcat x86 cores and fully support DirectX11, DirectCompute (Microsoft programming interface for GPU computing) and OpenCL (cross-platform programming interface standard for multi-core x86 and accelerated GPU computing). Both also include UVD dedicated hardware acceleration for HD video including 1080p resolutions.[11][12][13][14] This platform consists of:

More information AMD mobile, Initial platform ...

"Ontario" (40 nm)

More information Model Number, Step. ...

"Zacate" (40 nm)

  • SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, PowerNow!, AMD-V
  • Memory support: DDR3 SDRAM, DDR3L SDRAM (Single-channel, up to 1066 MHz)
  • 2.5 GT/s UMI.
  • Config GPU are Unified shaders : Texture mapping units : Render output units
  • Socket FT1 (BGA-413)
More information Model Number, Step. ...

Sabine (Fusion) platform (2011)

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The Sabine platform[15] introduced on June 30, 2011, for the AMD Mainstream Notebook Platform consists of:

More information AMD mobile, Initial platform ...

"Llano" (32 nm)

  • SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V, Turbo Core
  • Memory support: 1.35 V DDR3L-1333 memory, in addition to regular 1.5 V DDR3 memory specified (Dual-channel)
  • 2.5 GT/s UMI.
  • Transistors: 1.148 billion
  • Die size: 228 mm²
More information Model Number, Step. ...

1 Unified shaders : Texture mapping units : Render output units

Brazos 2.0 platform (2012)

AMD Ultrathin Platform introduced on June 6, 2012, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It will feature the 40 nm Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and all-in-ones) APUs. This platform consists of:

More information AMD mobile, Initial platform ...

"Ontario", "Zacate" (40 nm)

  • SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, PowerNow!, AMD-V
  • Single-channel DDR3 SDRAM, DDR3L SDRAM
  • 2.5 GT/s UMI.
  • Config GPU are Unified shaders : Texture mapping units : Render output units
  • Socket FT1 (BGA-413)
More information Model Number, Step. ...

Comal (Fusion) platform (2012)

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Perspective

The Comal platform introduced on May 15, 2012, for the AMD Mainstream Notebook Platform consists of:

More information AMD mobile, Initial platform ...

"Trinity" (2012, 32 nm)

More information Model Number, Step. ...

1 Config GPU are Unified shaders : Texture mapping units : Render output units

"Richland" (2013, 32 nm)

  • Elite Performance APU.[16][17]
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, NX bit, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, CVT16, F16C, Turbo Core
  • Memory support: 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V DDR3 memory specified (Dual-channel)
  • 2.5 GT/s UMI.
  • Transistors: 1.303 billion
  • Die size: 246 mm²
More information Model Number, Step. ...

1 Config GPU are Unified shaders : Texture mapping units : Render output units

Jaguar (2013)

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More information AMD mobile, Initial platform ...

"Temash" (2013, 28 nm)

Elite Mobility APU:

More information Model, Step. ...

1 Unified shaders : Texture mapping units : Render output units

"Kabini" (2013, 28 nm)

Mainstream APU:

More information Model, Step. ...

1 Unified shaders : Texture mapping units : Render output units

Puma (2014)

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Perspective

Mullins, Tablet/2-in-1 APU

More information Model, Stepping ...

Beema, Notebook APU

More information Model, Stepping ...

Kaveri (2014)

More information Model number, CPU ...

Carrizo-L (2015)

More information Model, Stepping ...

Carrizo (2015)

More information Model number, CPU ...

Bristol Ridge (2016)

More information Model number, CPU ...

"Raven Ridge" (2017)

More information Model, Release date ...
  1. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Picasso" (2019)

Common features of Ryzen 3000 notebook APUs:

More information Branding and Model, CPU ...
  1. Core Complexes (CCX) × cores per CCX
  2. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. Model also available as PRO version[32][33][34], released April 8, 2019.

"Renoir" (2020)

U

More information Branding and model, CPU ...
  1. All of the iGPUs are branded as AMD Radeon Graphics.
  1. Core Complexes (CCX) × cores per CCX
  2. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

H

More information Branding and model, CPU ...
  1. All of the iGPUs are branded as AMD Radeon Graphics.
  1. Core Complexes (CCX) × cores per CCX
  2. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Lucienne" (2021)

Common features of Ryzen 5000 notebook APUs:

More information Branding and Model, CPU ...
  1. Core Complexes (CCX) × cores per CCX
  2. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. All of the iGPUs are branded as AMD Radeon Graphics.

"Cezanne" (2021)

U

More information Branding and model, CPU ...
  1. All of the iGPUs are branded as AMD Radeon Graphics.
  1. Core Complexes (CCX) × cores per CCX
  2. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. Model also available as Pro version as 5450U,[44] 5650U,[45] 5850U,[46] released on March 16, 2021.

H

More information Branding and model, CPU ...
  1. All of the iGPUs are branded as AMD Radeon Graphics.
  1. Core Complexes (CCX) × cores per CCX
  2. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Barceló" (2022)

More information Branding and model, CPU ...
  1. All of the iGPUs are branded as AMD Radeon Graphics.
  1. Core Complexes (CCX) × cores per CCX
  2. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. Model also available as Pro version as 5475U,[60] 5675U,[61] 5875U,[62] released on April 19, 2022.
  2. Model also available as Chromebook optimized version as 5425C,[63] 5625C,[64] 5825C,[65] released on May 5, 2022.

"Rembrandt" (2022)

Common features of Ryzen 6000 notebook APUs:

  • Socket: FP7, FP7r2.
  • All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 16 PCIe 4.0 lanes.
  • Native USB 4 (40Gbps) Ports: 2
  • Native USB 3.2 Gen 2 (10Gbps) Ports: 2
  • Includes integrated RDNA 2 GPU.
  • Fabrication process: TSMC N6 FinFET.
More information Branding and model, CPU ...
  1. Core Complexes (CCX) × cores per CCX
  2. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. Model also available as PRO version (6650U[67], 6650H[68], 6650HS[69], 6850U[70], 6850H[71], 6850HS[72], 6950H[73], 6950HS[74]), released on April 19, 2022.

Mendocino (7020 series, Zen2/RDNA2 based)

Common features of Ryzen 7020 notebook APUs:

  • Socket: FT6
  • All the CPUs support LPDDR5-5500 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 4 PCIe 3.0 lanes.
  • Native USB 4 (40Gbps) Ports: 0
  • Native USB 3.2 Gen 2 (10Gbps) Ports: 1
  • Includes integrated RDNA 2 GPU.
  • Fabrication process: TSMC N6 FinFET.
More information Branding and Model, CPU ...
  1. Core Complexes (CCX) × cores per CCX
  2. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  3. Model also available as Chromebook optimized version as 7520C[76] and 7320C[77] released on May 23, 2023

Barcelo-R (7030 series, Zen3/GCN5 based)

Common features of Ryzen 7030 notebook APUs:

  • Socket: FP6.
  • All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 16 PCIe 3.0 lanes.
  • Native USB 4 (40Gbps) Ports: 0
  • Native USB 3.2 Gen 2 (10Gbps) Ports: 2
  • Includes integrated GCN 5th generation GPU.
  • Fabrication process: TSMC N7 FinFET.
More information Branding and Model, CPU ...
  1. Core Complexes (CCX) × cores per CCX
  2. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Rembrandt-R (7035 series, Zen3+/RDNA2 based)

Common features of Ryzen 7035 notebook APUs:

  • Socket: FP7, FP7r2.
  • All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 16 PCIe 4.0 lanes.
  • Native USB 4 (40Gbps) Ports: 0
  • Native USB 3.2 Gen 2 (10Gbps) Ports: 2
  • Includes integrated RDNA 2 GPU.
  • Fabrication process: TSMC N6 FinFET.
More information Branding and model, CPU ...
  1. Core Complexes (CCX) × cores per CCX
  2. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Phoenix (7040 series, Zen4/RDNA3 based)

Common features of Ryzen 7040 notebook APUs:

  • Socket: FP7, FP7r2, FP8.
  • All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • All models support AVX-512 using a half-width 256-bit FPU.
  • PCIe 4.0 support.
  • Native USB 4 (40Gbps) Ports: 2
  • Native USB 3.2 Gen 2 (10Gbps) Ports: 2
  • Includes integrated RDNA 3 GPU.
  • Includes XDNA AI Engine (Ryzen AI).
  • Fabrication process: TSMC N4 FinFET.
More information Branding and model, CPU ...
  1. Core Complexes (CCX) × cores per CCX or Zen 4 + Zen 4c cores
  2. PRO versions launched on 13 June 2023.
  3. China-only version of the HS SKU that lacks support for AMD EXPO and FreeSync technologies.
  4. Zen 4 cores' base frequency / Zen 4c cores' base frequency
  5. Zen 4 cores' boost frequency / Zen 4c cores' boost frequency

Dragon Range (7045 series, Zen4/RDNA2 based)

Common features of Ryzen 7045 notebook CPUs:

  • Socket: FL1.
  • All the CPUs support DDR5-5200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • All the CPUs support 28 PCIe 5.0 lanes.
  • Native USB 4 (40Gbps) Ports: 0
  • Native USB 3.2 Gen 2 (10Gbps) Ports: 4
  • Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost)[i].
  • Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O and graphics die).
More information Branding and model, Cores (threads) ...
  1. Core Complexes (CCX) × cores per CCX
  1. Self identifies as "AMD Radeon 610M". See RDNA 2 § Integrated graphics processors (iGPs).
  2. Only one of the two CCXes has additional 64 MB of 3D V-Cache. Only the CCX without 3D V-Cache will be able to reach the maximum boost clocks. The CCX with 3D V-Cache will clock lower.

See also

References

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