HiSilicon

HiSilicon (海思^S, Hǎisī^P) è una azienda di semiconduttori fabless cinese con sede a Shenzhen, Cina; è interamente posseduta da Huawei^[1].

HiSilicon
Logo
Stato	Cina
Forma societaria	Sussidiaria
Fondazione	2004
Sede principale	Shenzhen
Gruppo	Huawei
Settore	Informatico
Prodotti	SoCs
Sito web	www.hisilicon.com

HiSilicon ha acquisito licenze da ARM Holdings per almeno i seguenti core: ARM Cortex-A9 MPCore, ARM Cortex-M3, ARM Cortex-A7 MPCore, ARM Cortex-A15 MPCore,^[2][3] ARM Cortex-A53, ARM Cortex-A57 e anche per la GPU Mali-T628 MP4.^[4][5] HiSilicon ha anche acquisito licenze da Vivante Corporation per il loro motore grafico GC4000. Viene ritenuta il più grande progettista di circuiti integrati della Cina.^[6] Produce i system-on-a-chip "KIRIN" e "K3".

Prodotti

K3V1

Model Number	Fab	CPU				GPU		Memory Technology			GPS	wireless			Disponibile da	Dispositivi
		Instruction set	Microarcitettura	Cores	Frq (MHz)	Microarcitettura	Frq (MHz)	Type	Bus width (bit)	Bandwidth (GB/s)		Cellular	WLAN	PAN
K3V1 (Hi3611)	130 nm	ARMv5	ARM9E	1	800										2009	Babiken Vefone V1, Ciphone 5 (C5), T5355, IHTC HD-2, 5-inch Huawei UMPC

K3V2

Il primo prodotto conosciuto di HiSilicon è il K3V2 usato nello smartphone Huawei Ascend D Quad XL (U9510)^[7] e nel tablet Huawei MediaPad 10 FHD7.^[8] Questo chipset è basato su l'ARM Cortex-A9 MPCore fabbricato a 40 nm ed usa la GPU Vivante GC4000 GPU a 16 core.^[9] Il SoC supporta LPDDR2-1066, ma i prodotti effettivamente realizzati usano invece l'LPDDR-900 per avere un basso consumo di corrente.

Model Number	Fab	CPU				GPU		Memory Technology			GPS	wireless			Disponibile da	Dispositivi
		Instruction set	Microarchitecture	Cores	Frq (GHz)	Microarchitecture	Frq (MHz)	Type	Bus width (bit)	Bandwidth (GB/s)		Cellular	WLAN	PAN
K3V2 (Hi3620)	40 nm	ARMv7	Cortex-A9 L1: 32 KB instruction + 32 KB data, L2: 1 MB	4	1.5	Vivante GC4000	480 MHz, 30.7 GFLOPS	LPDDR2	64-bit dual-channel	7.2 (up to 8.5)	N.D.	N.D.	N.D.	N.D.	2012	Huawei MediaPad 10 FHD, Huawei Ascend D2 (U9510), Huawei Honor 2 (U9508), Huawei Ascend P6S, Huawei Ascend P2, Huawei Ascend Mate, Lenovo A376, STREAM X (GSL07S))

K3V2E

Model Number	Fab	CPU				GPU		Memory Technology			Nav	wireless			Sampling Availability	Utilizing Devices
		Instruction set	Microarchitecture	Cores	Frq (GHz)	Microarchitecture	Frq (MHz)	Type	Bus width (bit)	Bandwidth (GB/s)		Cellular	WLAN	PAN
K3V2E	40 nm	ARMv7	Cortex-A9 L1: 32 KB instruction + 32 KB data, L2: 1 MB	4	1.5	Vivante GC4000	480 MHz, 30.7 GFLOPS	LPDDR2	64-bit dual-channel	7.2 (up to 8.5)	N.D.	N.D.	N.D.	N.D.	2013	Huawei Honor 3

KIRIN 620

• supporta - USB2 / 13MP / Codifica video 1080P

Model Number	Fab	CPU				GPU		Memory Technology			Nav	wireless			Sampling Availability	Utilizing Devices
		Instruction set	Microarchitecture	Cores	Frq (GHz)	Microarchitecture	Frq (MHz)	Type	Bus width (bit)	Bandwidth (GB/s)		Cellular	WLAN	PAN
KIRIN 620	28 nm	ARMv8-A	Cortex-A53	8	1.2 GHz (A53)	Mali-450 MP4	700 MHz	LPDDR3 ( MHz)	64-bit dual-channel	12.8	N.D.	DUAL SIM LTE Cat.4 (150 Mbit/s)	N.D.	N.D.	Q1 2015	Huawei P8 Lite, Huawei X4, Huawei Honor 4C

KIRIN 910

Model Number	Fab	CPU				GPU		Memory Technology			Nav	wireless			Sampling Availability	Utilizing Devices
		Instruction set	Microarchitecture	Cores	Frq (GHz)	Microarchitecture	Frq (MHz)	Type	Bus width (bit)	Bandwidth (GB/s)		Cellular	WLAN	PAN
KIRIN 910	28 nm HPM	ARMv7	Cortex-A9	4	1.6	ARM Mali-450 MP4	533 MHz	LPDDR3	32-bit single-channel	6.4	N.D.	LTE Cat.4	N.D.	N.D.	H1 2014	HP Slate 7 VoiceTab Ultra, Huawei MediaPad X1,[10] Huawei P6 S,[11] Huawei MediaPad M1,[12] Huawei Honor 3C 4G
KIRIN 910T					1.8		700 MHz	LPDDR3	32-bit single-channel	6.4	N.D.	LTE Cat.4	N.D.	N.D.	H1 2014	Huawei Ascend P7

KIRIN 920

• Il SoC KIRIN 920 contiene anche un processore di immagini che supporta fino a 32 Megapixel

Model Number	Fab	CPU				GPU		Memory Technology			Nav	wireless			Sampling Availability	Utilizing Devices
		Instruction set	Microarchitecture	Cores	Frq (GHz)	Microarchitecture	Frq (MHz)	Type	Bus width (bit)	Bandwidth (GB/s)		Cellular	WLAN	PAN
KIRIN 920	28 nm HPM	ARMv7	Cortex-A15 Cortex-A7 big.LITTLE	4+4	1.7 GHz (A15) 1.3 GHz (A7)	Mali-T624 MP4	600 MHz[senza fonte]	LPDDR3 (1600 MHz)	32-bit dual-channel	12.8	N.D.	LTE Cat.6 (300 Mbit/s)	N.D.	N.D.	H2 2014	Huawei Honor 6[13]
KIRIN 925	28 nm HPM	ARMv7	Cortex-A15 Cortex-A7 big.LITTLE	4+4	1.8 GHz (A15) 1.3 GHz (A7)	Mali-T628 MP4		LPDDR3 (1600 MHz)	32-bit dual-channel	12.8	N.D.	LTE Cat.6 (300 Mbit/s)	N.D.	N.D.	Q3 2014	Huawei Ascend Mate7, Huawei Honor 6 Plus

KIRIN 930

• supporta - SD 3.0 (UHS-I) / eMMC 4.51 / Dual-Band a/b/g/n WI_FI / BT 4.0 Low Energy / USB2 / 32MP ISP / Codifica video 1080P

Model Number	Fab	CPU				GPU		Memory Technology			Nav	wireless			Sampling Availability	Utilizing Devices
		Instruction set	Microarchitecture	Cores	Frq (GHz)	Microarchitecture	Frq (MHz)	Type	Bus width (bit)	Bandwidth (GB/s)		Cellular	WLAN	PAN
KIRIN 930	28 nm HPM	ARMv8-A	Cortex-A53e Cortex-A53 big.LITTLE	4+4	2.0 GHz (A53e) 1.5 GHz (A53)	Mali-T628 MP4		LPDDR3 (1600 MHz)	64-bit dual-channel	12.8	N.D.	DUAL SIM LTE Cat.6 (DL:300 Mbit/s UP:50 Mbit/s)	N.D.	N.D.	Q1 2015	Huawei MediaPad X2, Huawei P8
KIRIN 935	28 nm HPM	ARMv8-A	Cortex-A53e Cortex-A53 big.LITTLE	4+4	2.2 GHz (A53e) 1.5 GHz (A53)	Mali-T628 MP4		LPDDR3 (1600 MHz)	64-bit dual-channel	12.8	N.D.	DUAL SIM LTE Cat.6 (DL:300 Mbit/s UP:50 Mbit/s)	N.D.	N.D.	Q1 2015	Huawei Honor 7, Huawei P8 MAX, Huawei Mate S

KIRIN 940

• supporta - SD 4.1 (UHS-I) / eMMC 5.1 / MU-MIMO ac WI_FI / BT 4.2 Smart / USB3.0 / 32MP ISP / Codifica video 4K

Model Number	Fab	CPU				GPU		Memory Technology			Nav	wireless			Sampling Availability	Utilizing Devices
		Instruction set	Microarchitecture	Cores	Frq (GHz)	Microarchitecture	Frq (MHz)	Type	Bus width (bit)	Bandwidth (GB/s)		Cellular	WLAN	PAN
KIRIN 940	16 nm FinFET Plus[14]	ARMv8-A	Cortex-A72 Cortex-A53 big.LITTLE	4+4	2.2 GHz (A72) 1.5 GHz (A53)	Mali-T860		LPDDR4	64-bit dual-channel	12.8	N.D.	DUAL SIM LTE Cat.7 (DL:300 Mbit/s UP:100 Mbit/s)	N.D.	N.D.	Q3 2015

KIRIN 950

• supporta: - SD 4.1 (UHS-II) / UFS 2.0 / eMMC 5.1 / MU-MIMO 802.11ac Wi-Fi / Bluetooth 4.2 Smart / USB 3.0 / NFS / Dual ISP (42 MP) / Codifica video 10-bit 4K nativa / coprocessore i5 / Tensilica HiFi 4 DSP

Modello	Fab	CPU				GPU		Tecnologia memoria			Nav	wireless			Disponibile da	Dispositivi
		Instruction set	Microarchitettura	Core	Frq (GHz)	Microarchitettura	Frq (MHz)	Tipo	Larghezza Bus (bit)	Banda (GB/s)		Reti cellulare	WLAN	PAN
KIRIN 950	16 nm FinFET Plus	ARMv8-A	Cortex-A72 Cortex-A53 big.LITTLE	4+4	2.3 GHz (A72) 1.8 GHz (A53)	Mali-T880 MP4	900 MHz(122.4GFlops)	LPDDR4	64-bit dual-channel	25.6GB/s	N.D.	DUAL SIM LTE Cat.10 (DL:450 Mbit/s UP:100 Mbit/s)	N.D.	N.D.	Q4 2015	Huawei Mate 8, Honor 8, Honor V8 (KNT-AL10, KNT-TL10)
Kirin 955[15]	16 nm FinFET Plus	ARMv8-A	Cortex-A72 Cortex-A53 big.LITTLE	4+4	2.5 GHz (4 x A72) 1.8 GHz (4 x A53)	Mali-T880 MP4	900 MHz(122.4GFlops)	LPDDR3(3 GB) LPDDR4 (4 GB)	64-bit dual-channel	25.6 GB/s	N.D.	Dual SIM LTE Cat.6	N.D.	N.D.	Q2 2016	Huawei P9, Huawei P9 Plus, Honor V8 (KNT-AL20), Honor Note 8

Kirin 960

• Interconnect: ARM CCI-550, Storage: UFS 2.1, eMMC 5.1

Modello	Fab	CPU				GPU		Tecnologia memoria			Nav	wireless			Disponibile da	Dispositivi
		Instruction set	Microarchitettura	Core	Frq (GHz)	Microarchitettura	Frq (MHz)	Tipo	Larghezza Bus (bit)	Banda (GB/s)		Reti cellulare	WLAN	PAN
Kirin 960[16]	TSMC 16 nm FFC	ARMv8-A	Cortex-A73 Cortex-A53 big.LITTLE	4+4	2.362 (A73) 1.844 (A53)	Mali-G71 MP8	1037 MHz (282GFlops)	LPDDR4-1800	64-bit(2x32-bit) Dual-channel	29.8	N.D.	Dual SIM LTE Cat.12 LTE 4x CA, 4x4 MIMO	N.D.	N.D.	Q4 2016	Huawei Mate 9, Huawei Mate 9 Porsche Design, Huawei Mate 9 Pro, Honor V9, Huawei P10, Huawei P10 Plus, Honor 8 pro, Honor 9

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